Realize your nano vision

Electrum resources-Dice mounting

  Dice Mounting

Dice are sawn or cleaved from the substrates after completed processing. Mounting and forming of electrical contacts are made by soldering, wire bonding or flip chip bonding. 

Click on heading to sort the table.
DetailsBonderKarl SussCB8 Substrate Bonder
DetailsOrthodyneOrthodyne20 Large Wirebonder
DetailsRakelDage Precima InternationalRakel
DetailsBertilWest Bond 7476E-79 Manual Wedge-Wedge Wire Bonder
DetailsBall bonderF&K Delvotec Semiconductor GmbH5410
DetailsDisco DAD sawDiscoDAD 320
DetailsFH MS OlympusLabrum klimatLAF
DetailsFH MS NikonLabrum klimatLAF
DetailsESEC Automatic WirebonderESEC3100 plus
DetailsParoteq Bonder AlbanovaParoteq GmbHH-system
DetailsMicro Diamond Scriber, AlbanovaOEG GmbHMR-200
DetailsWire bonder AlbanovaKulicke - Soffa4523D