How can MEMS research move from the lab to industrial applications? Join our next INFRACHIP Digital School to explore fabrication technologies, advanced packaging and industry challenges.
🎤 On the programme:
🔹Marco Sica, Tyndall National Institute
Introducing INFRACHIP: An overview of the project and its role in strengthening Europe’s semiconductor ecosystem.
🔹Petter Barreng, VIDEM, CTO
Bridging Academia and Industry: How shared university infrastructure helps deep-tech startups accelerate sensor development.
🔹 Prof. Ausrine Bartasyte, Institut FEMTO-ST / Université Marie et Louis Pasteur, Université Paris-Saclay, Institut Universitaire de France
Thin LiNbO₃ Films for Electro-Active Devices: Challenges and advances in thin-film growth.
🔹 Giovanni Delrosso, PHOSPACK Tmi, Founder & CTO
Glass Multilayer Interposers and MEMS: Fabrication technologies and advanced packaging for signal and power integrity.
🔹Ventsislav Yantchev, Technical University of Sofia
Microacoustic Wave Technology for Wireless Applications: SAW and BAW technologies for wireless communications and passive sensors.
📅 18 November 2026
Online, open to researchers, PhD students, engineers and industry professionals.
Explore the programme and register: DIGITAL SCHOOL – MEMS: R&D challenges and industry landscape – Application Form – INFRACHIP
This training is part of InfraChip, a European initiative (2024–2027) aiming to build a distributed infrastructure for sustainable semiconductor development. InfraChip connects research communities like ASCENT+, EMERGE, and EnABLES, and promotes innovation in materials and processes. It also invests in talent development through hands-on training—such as the course at Chalmers. Together, these efforts strengthen Europe’s capacity to innovate in semiconductor technologies, from research to industrial application.
