Skip to content
Myfab
Myfab logotype

Myfab has a leading role in the European Chips Act

Collage of different chips

Reporting by Myfab Lund

Many in Europe have been eagerly awaiting the results of the first calls in the European Chips Act for pilot lines, with the aim is to enhance existing and develop new advanced pilot lines across the Union to enable development and deployment of cutting-edge semiconductor technologies and next-generation semiconductor technologies.

Also, we in NanoLund have our stake in the call, and have together with Swedish partners at Linköping, Chalmers and KTH been invited to be part of a pilot line for Wide Bandgap materials. We were very happy when the Chips JU announced that the Public Authorities Board approved all four pilot line proposals.For Lund University and LTH, the Faculty of Engineering this means an important piece in the puzzle of a strategic initiative within the semiconductor area.

Lund University and Vanya Darakchieva will lead the Workpackage on III- N radiofrequency and power device technologies of the Wide Bandgap pilotline and will contribute with a total effort of more the 8 M€ over 5 years.

Full article at Myfab Lund here: https://www.nano.lu.se/article/nanolund-and-lund-nano-lab-has-leading-role-european-chips-act

Highlights and events

The conceptual image shows how the researchers’ sculpted pattern of tiny hills and valleys – smaller than one millionth of a hair’s thickness – on the substrate (MgO, at the bottom) guides how the atoms in the superconducting material (YBCO, on top) settle. At the interface between the two layers, an electronic landscape allows superconductivity to occur at higher temperatures than previously possible – even when high magnetic fields were are applied. Credit: Chalmers University of Technology / Riccardo Arpaia
2026 03 18
Myfab Chalmers

Superconductor advance could unlock ultra-energy-efficient electronics

Read more
Event a university house - Ångström Laboratory - Myfab Uppsala
2026 03 12
Myfab Chalmers , Myfab , Myfab KTH , Myfab Lund , Myfab Uppsala

Nordic user meeting: NNTN & NNUM in Uppsala

Read more
Illustration of the device concept. A memory chip based on stacked quantum materials. By placing a magnetic layer on top of a topological material, the researchers were able to switch magnetization using very small electrical currents and without applying an external magnetic field. Illustration: Lalit Pandey
2026 03 11
Myfab Chalmers

Quantum materials breakthrough for energy-efficient data processing

Read more
Ove Öhman has been a bridge-builder between academia and the business sector for several decades and has helped strengthen Uppsala’s innovation environment. Photo: Mikael Wallerstedt, Uppsala University
2026 03 10
Myfab Uppsala

Ove Öhman receives prize as a bridge-builder between research and innovation

Read more
See all highlights